description thisf precisionf opticalf performancef ovalf ledf isf specif - callyf designedf forf fullf color/videof andf passengerf infor - mationfsigns.fthefovalfshapedfradiationfpatternfandfhighf luminousf intensityf ensuref thatf thisf devicef isf excellentf forfwideffeldfoffviewfoutdoorfapplicationsfwherefafwidef viewingf anglef andf readabilityf inf sunlightf aref essential.f thisf lampf hasf veryf smooth,f matchedf radiationf patternsf ensuringf consistentf colorf mixingf inf fullf colorf applica - tions,f messagef uniformityf acrossf thef viewingf anglef off thefsign.fhighfefciencyfledfmaterialfisfusedfinfthisflamp:f aluminiumf indiumf galliumf phosphidef (alingap)f forf redf color.fthefhigherfperformancefalingapfiifisfused. thefpackagefepoxyfcontainsfbothfuv-afandfuv-bfinhibi - torsftofreducefthefefectsfofflongftermfexposureftofdirectf sunlight. features ? f wellfdefnedfspatialfradiationfpattern ? f highfbrightnessfmaterial ? f redfalingapf630fnm ? f tintedfandfdifused ? f typicalfviewingfanglef40x100 benefts ? f viewingfanglefdesignedfforfwideffeldfoffviewf f f applications ? f superiorfperformancefforfoutdoorfenvironments applications ? f fullfcolorfsigns ? f commercialfoutdoorfadvertising package dimensions hlmp-hd57 5 mm standard oval precision optical performance red led data sheet 5.20 (0.204) 10.85 0.50 (0.427 0.019) 2.54 (0.10) 7.00 (0.275) 0.70 (0.028) 1.0 (0.039) max. max. sq. typ. 24.00 (0.945) min. 1.50 0.15 (0.059 0.006) 1.00 (0.039) min. 0.50 0.10 (0.020 0.004) note: measured at base of lens. 3.80 (0.150) notes: 1. dimensions in millimeters (inches). 2. tolerance 0.25 mm unless otherwise noted.
device selection guide color and luminous luminous dominant intensity intensity wavelength iv (mcd) at iv (mcd) at tinting part number d (nm) typ. 20 ma min. 20 ma max. type HLMP-HD57-NR0XX f redf630 f 680f 1900f red notes: 1.f thefluminousfintensityfisfmeasuredfonfthefmechanicalfaxisfofftheflampfpackage. .f thefopticalfaxisfisfcloselyfalignedfwithfthefpackagefmechanicalfaxis. 3.f thefdominantfwavelength,f d ,fisfderivedffromfthefchromaticityfdiagramfandfrepresentsfthefcolorfofftheflamp. 4.f tolerancefforfluminousfintensityfisff15%. part numbering system h l m p - x x x x - x x x x x mechanical options 00:fbulkfpackaging zz:fflexi-bin;fammofpacks color bin selections 0:fnofcolorfbinflimitation maximum intensity bin 0:fnofivfbinflimitation minimum intensity bin refer to device selection guide color d:f630fnmfred package h:f5fmmfovalf40ofxf100o absolute maximum ratings at t a = 25?c parameter value dcfforwardfcurrent [1] f 50fma peakfpulsedfforwardfcurrent f[] f 100fma averagefforwardfcurrent f 30fma powerfdissipation f 10fmw reversefvoltage f 5fvf(i r f=f100fa) ledfjunctionftemperature f 130?c operatingftemperaturefrange f C40?cftof+100?c storageftemperaturefrange f C40?cftof+1 0?c notes: 1.f derateflinearlyfasfshownfinffiguref3. .f dutyffactorf30%,ffrequencyf1fkhz. note:fpleasefreferftofabf5337fforfcompletefinformationfaboutfpartfnumberingfsystem.
3 electrical/optical characteristics t a = 25?c parameter symbol min. typ. max. units test conditions forwardfvoltage f v f f f . f .4f vf i f f=f0fma reversefvoltage f v r f 5 f f f f i r f=f100fa capacitance f cf f 40 f f pff v f f=f0,fff=f1fmhz thermalfresistance f r j-pin f f 40 f f ?c/wf ledfjunction-to-cathode f f f f f f f f lead dominantfwavelength f[1] f d f 6f 630f 634f nmf i f f=f0fma peakfwavelength f p f f 639 f f nmf peakfoffwavelengthfof f f f f f f f f spectralfdistributionfat f f f f f f f f i f f=f0fma spectralfhalfwidth f ? 1/ f f 17 f f nmf wavelengthfwidthfat f f f f f f f f spectralf distributionf 1 / f power f f f f f f f pointfatfi f f=f0fma luminousfefcacy f[] f v f f 155 f f lm/wf emittedfluminousfpower/ f f f f f f f f emittedfradiantfpower luminousfflux f j v f f 1300 f f mlmf i f f=f0fma luminousfefciency f[3] f e f f 30 f f lm/wf luminousfflux/electricalfpowerf f f f f f f f i f f=f0fma notes: 1.f thefdominantfwavelengthfisfderivedffromfthefchromaticityfdiagramfandfrepresentsfthefcolorfofftheflamp. .f thefradiantfintensity,fiefinfwattsfperfsteradian,fmayfbeffoundffromfthefequationfief=fiv/ v fwherefivfisfthefluminousfintensityfinfcandelasfandf vf fisf thefluminousfefcacyfinflumens/watt. 3.f e f=f j v f/fi f ffxfv f f,fwheref j v ffisfthefemittedfluminousffux,fifffisfelectricalfforwardfcurrentfandfvfffisfthefforwardfvoltage. figure 1. relative intensity vs. wavelength. figure 2. relative luminous intensity vs. forward current. figure 3. forward current vs. ambient temperature. hlmp-hd57 fig 1 wavelength ? nm relative intensity 1.0 0.5 0 600 700 650 550 hlmp-hd57 fig 2 relative intensity (normalized at 20 ma) 0 0 forward current ? ma 20 40 2.0 1.0 50 0.5 1.5 2.5 30 10 0 10 20 30 40 50 60 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - o c i f max. - maximum forward current - ma
4 figure 6. spatial radiation pattern-major axis. intensity bin limits (mcd at 20 ma) bin name min. max. nf 680f 880 pf 880f 1150 qf 1150f 1500 rf 1500f 1900 tolerancefwillfbeff15%fofftheseflimits. note: 1.f binf categoriesf aref establishedf forf classif - cationf off products.f productsf mayf notf bef availablefinfallfbinfcategories. hlmp-hd57 fig 6 relative intensity 1.0 0 angle ? degrees 0.5 -90 -50 -30 10 50 90 -10 30 -70 70 figure 7. relative light output vs junction temperature figure 4. forward current vs. forward voltage. figure 5. spatial radiation pattern-minor axis. 0 40 20 i f ? forward current ? ma v f ? forward voltage ? v 0 3.0 hlmp-hd57 fig 4 1.5 2.0 2.5 10 30 50 1.0 0.5 hlmp-hd57 fig 5 relative intensity 1.0 0 angle ? degrees 0.5 -90 -50 -30 10 50 90 -10 30 -70 70 0.1 1 10 -40 -20 0 2 0 4 0 6 0 8 0 100 120 t j - junction temperature - c relative light output (normalized at t j = 25c
precautions: lead forming: ? f thefleadsfoffanfledflampfmayfbefpreformedforfcutftof lengthfpriorftofinsertionfandfsolderingfonfpcfboard. ? f forf betterf control,f itf isf recommendedf tof usef properf toolftofpreciselyfformfandfcutfthefleadsftofapplicablef lengthfratherfthanfdoingfitfmanually. ? f iffmanualfleadfcuttingfisfnecessary,fcutfthefleadsfafterf thef solderingf process.fthef solderf connectionf formsf af mechanicalfgroundfwhichfpreventsfmechanicalfstressf duef tof leadf cuttingf fromf travelingf intof ledf package.f thisfisfhighlyfrecommendedfforfhandfsolderfoperation,f asfthefexcessfleadflengthfalsofactsfasfsmallfheatfsink. soldering and handling: ? f carefmustfbeftakenfduringfpcbfassemblyfandfsolderingf processftofpreventfdamageftofthefledfcomponent.f ? f ledf componentf mayf bef efectivelyf handf solderedf tof pcb.f however,f itf isf onlyf recommendedf underf unavoidablefcircumstancesfsuchfasfrework.fthefclosestf manualfsolderingfdistancefoffthefsolderingfheatfsourcef (solderingfironsftip)ftofthefbodyfisf1.59mm.fsolderingf thef ledf usingf solderingf ironf tipf closerf thanf 1.59mmf mightfdamagefthefled. note:f 1.f pcbf withf diferentf sizef andf designf (componentf density)f willf havef diferentf heatf massf (heatf capacity).f thisf mightf causef af changef inf temperaturef experiencedf byf thef boardf iff samef wavef solderingf settingfisfused.fso,fitfisfrecommendedftofre-calibratefthefsolderingf proflefagainfbeforefloadingfafnewftypefoffpcb. .f avagoftechnologiesf highf brightnessf ledf aref usingf highf efciencyf ledfdiefwithfsinglefwirefbondfasfshownfbelow.fcustomerfisfadvisedf tof takef extraf precautionf duringf wavef solderingf tof ensuref thatf thef maximumfwaveftemperaturefdoesfnotfexceedf 50cfandfthefsolderf contactftimefdoesfnotfexceedingf3sec.fover-stressingfthefledfduringf solderingfprocessfmightfcausefprematureffailureftofthefledfdueftof delamination. avago technologies led confguration 1.59mm ? f esdf precautionf mustf bef properlyf appliedf onf thef solderingf stationf andf personnelf tof preventf esdf damagef tof thef ledf componentf thatf isf esdf sensitive.f dofreferftofavagofapplicationfnotefanf114 fforfdetails.f thef solderingf ironf usedf shouldf havef groundedf tipf tof ensurefelectrostaticfchargefisfproperlyfgrounded. ? f recommendedfsolderingfcondition: wave soldering [1, 2] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max note:f 1)f abovef conditionsf refersf tof measurementf withf thermocouplef mountedfatfthefbottomfoffpcb. )f itfisfrecommendedftofusefonlyfbottomfpreheatersfinforderftofreducef thermalfstressfexperiencedfbyfled. ? f wavefsolderingfparametersfmustfbefsetfandfmaintainedf accordingftofthefrecommendedftemperaturefandfdwellf time.fcustomerfisfadvisedftofperformfdailyfcheckfonfthef solderingfprofleftofensurefthatfitfisfalwaysfconformingf tofrecommendedfsolderingfconditions. f note:felectricalfconnectionfbetweenfbottomfsurfacefoffledfdiefandf thefleadfframefisfachievedfthroughfconductivefpaste. ? f anyf alignmentf fxturef thatf isf beingf appliedf duringf wavef solderingf shouldf bef looselyf fttedf andf shouldf notfapplyfweightforfforcefonfled.fnonfmetalfmaterialf isfrecommendedfasfitfwillfabsorbflessfheatfduringfwavef solderingfprocess. ? f atf elevatedf temperature,f ledf isf moref susceptiblef tof mechanicalfstress.ftherefore,fpcbfmustfallowedftofcoolf downf tof roomf temperaturef priorf tof handling,f whichf includesfremovalfoffalignmentffxtureforfpallet. ? f iffpcbfboardfcontainsfbothfthroughfholef(th)fledfandf otherfsurfacefmountfcomponents,fitfisfrecommendedf thatf surfacef mountf componentsf bef solderedf onf thef topfsidefoffthefpcb.fiffsurfacefmountfneedftofbefonfthef bottomf side,f thesef componentsf shouldf bef solderedf usingfrefowfsolderingfpriorftofinsertionfthefthfled. ? f recommendedf pcf boardf platedf throughf holesf (pth)f sizefforfledfcomponentfleads. led component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) ? f over-sizingf thef pthf canf leadf tof twistedf ledf afterf clinching.fonfthefotherfhandfunderfsizingfthefpthfcanf causefdifcultyfinsertingfthefthfled. allngap device cathode
6 ammo packs drawing 18.00 0.50 (0.7087 0.0197) 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) 9.125 0.625 (0.3593 0.025) 12.70 0.30 (0.50 0.0118) cathode 0.70 0.20 (0.0276 0.0079) 20.5 1.00 (0.8071 0.0394) a a view a-a ? 4.00 0.20 (0.1575 0.0079) typ. all dimensions in millimeters (inches). note: the ammo-packs drawing is applicable for packaging option -dd & -zz and regardless of standoff or non-standoff. example of wave soldering temperature profle for th led te tes peheat tblet wae laa wae ht a fe recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. referftofapplicationfnotefan5334fforfmorefinformationfaboutfsolderingfandfhandlingfoffhighfbrightnessfthfledflamps.
7 packaging box for ammo packs packaging label (i)f avagofmotherflabel:f(availablefonfpackagingfboxfoffammofpackfandfshippingfbox) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n r e v : d e p t i d : s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c
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